electronic packaging
英 [ɪˌlekˈtrɒnɪk ˈpækɪdʒɪŋ]
美 [ɪˌlekˈtrɑːnɪk ˈpækɪdʒɪŋ]
电子封装；电子组装
双语例句
- Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy
电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究 - Market prospects: as China's electronic packaging industry, to promote the rapid development of direct the metal ─ glass package technology development.
市场前景：随着我国电子封装业的飞速发展，直接促进着金属&玻璃封装技术的发展。 - Synthesis and performance of low water absorption phenol aralkyl curing agent for electronic packaging
低吸湿性电子封装苯酚-芳烷基型固化剂的合成及性能 - Influence of Interface on the Coefficient of Thermal Expansion of SiC/ Al Electronic Packaging Composite
界面SiO2层对SiC/Al电子封装材料热膨胀系数的影响 - A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging
高温电子封装界面失效分析及可靠性研究 - Progress in Research and Application of Si_p/ Al Composites for Electronic Packaging
电子封装用Sip/Al复合材料的研究应用进展 - Research and Development on Thermal Conductivity of SiC/ Al Composites Applied to Electronic Packaging
电子封装SiCp/Al复合材料导热性能研究与进展 - Optimal design of plastic electronic packaging component based on BP neural network
基于BP神经网络的模塑封电子器件优化设计 - Microstructure and properties of spray deposition 70% Si-Al alloy for electronic packaging applications
喷射沉积70%Si-Al合金电子封装材料的组织与性能 - Size effect of mechanical behavior of miniature solder joint interconnections in electronic packaging
电子封装微互连焊点力学行为的尺寸效应 - Synthesis of Phenol-Aralkyl Resin as Curing Agent for Electronic Packaging
电子封装固化剂苯酚-芳烷基型树脂的合成 - Study on Centrifugal Casting Process of the SiC Particle Reinforced Aluminum Matrix Composites for Electronic Packaging
电子封装用SiC颗粒增强铝基复合材料离心铸造成形工艺研究 - Research Progress of Diamond-Cu Composite Material for Electronic Packaging
电子封装材料用金刚石/铜复合材料的研究进展 - Electronic manufacturing consist of semiconductor manufactruing, electronic packaging and assembling.
电子制造包括半导体制造和电子封装与组装。 - The state-of-the-art of modern electronic packaging technologies and its future trends are de-scribed in the paper.
高度发达的信息社会急需先进的电子封装技术，本文概述了电子封装技术的现状和发展趋势。 - With the development of thin small outline electronic product, the technology of electronic packaging is more important gradually.
在电子产品集成化程度高且小、轻、薄的发展趋势影响下，电子封装技术日趋重要。 - The high reliability and low cost will lead thedevelopment of the electronic packaging.
集成电路封装的发展方向是高密度、低成本和高可靠性。 - Anodizing was employed to develop Al metal substrate applied for electronic packaging.
利用阳极氧化方法研制了应用于高密度封装中的铝金属基板。对其性能进行了测量。 - The rapid development of electronic packaging technology has led to strict requirement for packaging materials.
电子封装技术的快速发展对封装材料的性能提出了更为严格的要求。 - The Application of Several Electronic Packaging Technologies in Portable Electronics Products
几种电子封装技术在便携式电子产品中的应用 - An infiltration method for making SiCp/ ZL101 composite used for electronic packaging is presented.
提出了制备电子封装用SiCp/ZL101复合材料渗透法新工艺。 - Traditional Sn-Pb solders are widely used in the field of electronic packaging due to their excellent properties.
传统的Sn-Pb钎料由于其优异的综合性能被广泛应用于电子封装领域。 - Film/ substrate structures have been widely used in flexible electronics, electronic packaging, and Micro/ Nano-Electro-Mechanical-Systems.
薄膜／基底结构在柔性电子器件、电子封装以及微／纳电子机械系统等集成系统中有着广泛的应用。 - Electromigration of solder joint is becoming one of the key factors of the reliability of electronic packaging.
焊点中的电迁移是影响电子封装可靠性的关键因素之一。 - Therefore, it is very important to investigate the reliability of electronic packaging.
因此，对电子封装可靠性的分析非常重要。 - Electronic packaging is a multi-disciplinary field.
电子封装是一个多学科交叉的领域，求解可靠性涉及到多个物理场。 - Exploring new types of Lead-free solders have become one of the main contents on studying the electronic packaging materials.
开发新型无铅钎料已成为电子封装材料主要研究内容之一。